Molecular Dynamics Simulation of Polycrystalline Metal Under High Velocity Nanoscale Sliding

Abstract

Three-dimensional non-equilibrium molecular dynamics simulations are performed to investigate the tribological characteristics of polycrystalline Ni-Ni and Ni-Cu high-speed sliding systems. The grain size distribution, temperature profiles and heat density changes are obtained. Founded on simulation results a correlation between surface grain size and heat conduction is proposed which can help us to fully understand the mechanism of polycrystalline friction behavior and design better friction material. This interaction shows that the sizes of the grains located in the interface decrease and it increases the resistance of friction heat conduction during sliding.