Zhou Y, Yang P, Yuan C, Huo Y. Electrochemical Migration Failure of the Copper Trace on Printed Circuit Board Driven by Immersion Silver Finish. Chemical Engineering Transactions [Internet]. 20Jul.2013 [cited 22Nov.2024];33:559-64. Available from: https://www.cetjournal.it/index.php/cet/article/view/CET1333094