Deng G, Yang P, Qiu J, Liu G, Lv K. Transient Thermal Analysis of MCM towards Understanding Failure Mechanism of Intermittent Faults. Chemical Engineering Transactions [Internet]. 20Jul.2013 [cited 17Aug.2024];33:589-94. Available from: https://www.cetjournal.it/index.php/cet/article/view/CET1333099